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Lead-free solder series.

lead-free solder type

1, tin copper lead-free tin ( Sn99.3-Cu0.7 )

2, 3 tin silver copper solder bar ( Sn-Ag3.0-Cu0.5 )

3, 0.3 tin silver copper solder bar ( Sn-Ag0.3-Cu0.7 )

4, wave soldering lead-free solder ( lead-free wave soldering special )

5, hand dip furnace lead-free solder ( lead-free hand dip furnace special )

6, tin lead-free solder special

7, high temperature lead-free solder ( 400 degrees welding )

8, halogen-free soldering

9, lead-free pure tin solder

lead-free solder characteristics

of pure tin manufacturing, wettability, good fluidity, easy Shangxi.

bright spot, full, not Xuhan etc..

add enough antioxidant elements, antioxidative ability.

of pure tin, tin slag, reduce unnecessary waste.

lead-free RoHS standard, applicable the crest or hand dip furnace operation.

solder has the following advantages

1. melted slag amount less than ordinary solder, and has excellent antioxidant performance;

2. after the melting of low viscosity, good fluidity, high weldability, the most suitable for wave soldering process;

3. due to oxide inclusion is few, can minimize the sharp pull, bridging phenomenon, reliable welding quality, welding spot is bright and full.

lead-free solder advantages and scope of application

of the company’s production of environmentally friendly lead-free solder, has excellent wettability, shear strength, enough creep resistance, thermal fatigue resistance. The mechanical properties and good fluidity, high welding reliability, can inhibit the bridging phenomenon, improve the welding effect, tin slag amount less. The product is suitable for high precision electronic industry of wave soldering, reflow soldering and welding process, is the best choice of customers products.

lead-free solder quality characteristics

lead-free solder Sn Ag3.0 Cu0.5/ Sn Ag0.3 Cu0.7 / Sn Cu0.7 chemical composition table

The impurity content

alloy	component of	%
alloy	Sn	Ag	Cu	Pb	Sb	Fe	Zn	Bi	Al	As	Cd
SnAg3.0Cu0.5	allowance	3.01	0.516	<0.1	<0.1	<0.02	<0.001	<0.1	<0.001	<0.03	<0.002
SnAg0.3Cu0.7	allowance	0.301	0.706	<0.1	<0.1	<0.02	<0.001	<0.1	<0.001	<0.03	<0.002
Sn Cu0.7	allowance	0.001	0.705	<0.07	<0.1	<0.02	<0.001	<0.1	<0.001	<0.03	<0.002

NO	Item		Result									Test method
Lead-free solder SnAg3.0Cu0.5/Sn Ag0.3 Cu0.7/ Sn Cu0.7 chemical composition table two
1	Alloy		SnAg3.0Cu0.5			SnAg0.3 Cu0.7			Sn Cu0.7
2	Specific gravity		7.4			7.38			7.31			Gravity apparatus
3	Melting temperature℃		217			222			227			Thermal analysis of heating rate20℃/mm
4	Thermal conductivity		64#			65#			64#			Guess value
5	Elongation rate%		52			53			32			Tensile testing machine 10mm/mim25℃
6	Rate of expansion	240℃	78%			78%			76%			Using flux test
		250℃	78%			78%			76%
		260℃	79%			79%			77%
		270℃	79%			79%			77%
7	Wetting property		Ta	Tb	Fmax	Ta	Tb	Fmax	Ta	Tb	Fmax	Wetting balance Test of copper 0.33.52.5mm
		240℃	0.72	2.1	0.213	0.85	3.01	0.198	1	4.53	0.189
		250℃	0.37	1.46	0.213	0.71	2.52	0.195	0.86	2.79	0.186
		260℃	0.23	0.81	0.192	0.38	1.32	0.189	0.47	1.46	0.183
		270℃	0.21	0.48	0.183	0.28	0.65	0.182	0.31	0.8	0.179
8	Resistivity(%LACs)		15			14			13			Terminal method25℃
9	Copper corrosion test		Pass			Pass			Pass			Use 0.2mm Copper wire disconnection test
10	Creep strength test		>300 hrs			>300 hrs			>300 hrs			By weight 1KG145℃ Test
			>300 hrs			>300 hrs			>300 hrs			By weight 1KG145℃ Test
			>300 hrs			>300 hrs			>300 hrs			By weight 1KG145℃ Test
11	Thermal shock test		Pass			Pass			Pass			-40/80℃ Test
12	Ion migration		1000小时以上>1000hrds			1000小时以上>1000hrds			1000小时以上>1000hrds			40℃95% Test
13	Working temperature		Reference chart1			Reference chart2			Reference chart3

Lead-free solder models introduced

lead-free tin antioxidation:		product characteristics: suitable for hand soldering, soldering circuit board bright spot, produces less sludge, the working temperature is higher than the melting point of 40> 60> C operation best.
type			melting point ( ℃)		gravity	suggested applications
			solidus	liquidus
T101A	Sn99.95		232	232	7.28	furnace crest added, decreasing copper content
T703A	Sn-Cu0.3		227	230	7.31
T705A	Sn-Cu0.5-Ni		226	226	7.32	circuit board hand soldering, soldering
T707A	Sn-Cu0.7		227	227	7.32
T303A	Sn-Ag0.3-Cu0.7		217	228	7.33
T330A	Sn-Ag3.0-Cu0.5		217	218	7.40

lead-free ( leach line, tin tin ) for:		product characteristics: applicable to components foot, bare copper wire tin dipping and circuit board tin spraying process, the working temperature is 300> ~ 380>℃; mesophilic operation
type		melting point ( ℃)		(ratio )	suggested applications
type		solidus	liquidus	(ratio )	suggested applications
T101A	Sn99.95	232	232	7.28	tin, copper content
T705A	Sn-Cu0.5-Ni	226	226	7.32	tin spraying cylinder opening
T705N	Sn- Ni0.02	230	232	7.28	tin added with
T707	Sn-Cu0.7	227	227	7.32	without a foot, bare copper impregnated with

high-temperature lead-free tin:		product characteristics: suitable for enameled wire transformer, a paint, fast tin, the working temperature is 400> ~ 480>℃;; work best, tin surface smooth not film, first product for transformer.
type			melting point ( ℃)		(ratio )	suggested applications
			solidus	liquidus
T707B	Sn-Cu0.7		227	227	7.32	enameled wire transformer, Baptist tin
T330B	Sn-Ag3.0-Cu0.5		217	218	7.40

℃)

lead low tin:	product characteristics: apply to electronic control components, fire alarm, high buildings, library, high pressure food utensils, special bend process, glass ceramic welding, mold manufacturing modeling technology.
alloys	melting point (	suggested applications
Sn-Cu-Bi	200	220℃; welding;> > about
Sn-Bi	138	180℃; welding;> > about

The

lead-free solder material
class	melting point ( ℃)	(Tensile strength )	scalability ( %> )
Sn-Ag-Cu	217	5.3	27
Sn-Ag	221	4.7	33
Sn-Cu	227	3.3	48
Sn-Bi	138	7.6	33

tin solder is in a kind of product, tin can be divided into a tin lead and lead-free tin two, are used for circuit board welding. Pure tin manufacturing, wettability, good fluidity, easy Shangxi. Bright spot, full, not Xuhan etc.. Add enough resistance to oxidation of a elements, antioxidative ability. Pure tin, tin slag, reduce unnecessary waste.

Note the use of

tin , temperature two, solder contamination limit In three, scum in wave soldering removing dross is formed on the solder surface oxides, its production rate is dependent on temperature and stirring flow. The higher the temperature and the stirring flow of the solder surface is greater, the more the scum there. Can also be added antioxidants and the tin surface to form a layer of protective film to reduce oxidation of tin. The solder surface oxide can prevent oxidation of solder and, therefore, often need not removing dross. As long as it does not affect the wave drive, daily cleaning can be a time. Can also be pushed to a corner of tin slag, in the tin slag on adding a reducing powder stirring can be most for tin tin slag reduction.

In four,

in wave soldering tin of the new added in the process of wave soldering tin, the volume will continue to decrease, when reduced to a certain degree, should be timely to add new tin. In order to maintain the level and reduce the tin tin wave gap increased oxidation of tin.

five, Cu impurities removal (lead ), periodic inspection of solder tin component ( lead-free ) when Cu exceeds its solubility in Sn, Cu and Sn will form an intermetallic compound, usually Cu6Sn5, the melting point of over 500 ℃, so it exists in solid form. The Cu-Sn intermetallic compounds over there will seriously affect the welding quality. The traditional Sn-Pb solder accounted for 8.4, tin copper impurity Cu6Sn5 accounted for 8.28. Therefore in the lead process available " proportion method copper excretion ". The solder temperature to 190℃( tin lead solder at this time still to liquid), then stir solder for 1 minutes, then rest for 8 hours. Because Cu6Sn5 proportion than tin lead solder is small, the compound will float on the surface of the solder, the upper layer to remove impurity removal of impurity Cu. But half a month or a month in addition to Cu at a time, thus reducing the groove number, reduce cost. Lead free solder proportion ( in general about 7.4 ) than the small proportion of tin copper, tin copper impurities will sink into the bottom of the pot, solid not like lead process with " proportion method to remove impurities in copper row copper ". It should be regularly testing solder tin component, when found in copper and lead to the maximum allowable standards, timely replacement of solder. According to customers different yields, suggests 1~2 months furnace cleaning time.