Anodized series

of the company’s production of electroplating anode products used in very few impurities, high purity of high-quality Chunyang maker, in full accordance with international standards of production, are widely applied in the electroplating industry, usually using a star rod, eight shape anode rod, tinplate, tin hemisphere, can according to customer requirements of different shape, size of the anode casting products, more to meet the customer’s production needs.

electroplating anode series products:

Electroplating anode
	Tin plate	Tin hemisphere

, solder balls, the selection and use of

anode rod

in the PCB process, often using electroplating tin to on line protection, the tin lead anode quality put forward higher requirements. If the anode high impurity content, not only pollute the plating liquid to produce too much of the anode slime, and affect the quality of the coating. Such as the coating porosity, pinhole. Thus in the next section Tuixi process caused by PCB line corrosion and useless, so the requirements of tin or tin-lead anode impurity content must be an GB or JIS Z23282, QQ-S-517 standards.

PCB pattern plating common anode for: (1 ) pure tin above 99.9%. ( 2) 90/10 tin lead anode. ( 3) 63/37 tin lead anode.

is above three kinds of anode ( ball ) stick my company by the implementation of the standards listed below:

1: tin ingot chemical composition table

Grade			Sn99.90	Sn99.95	Sn99.99
Chemical composition%	Sn Not less than		99.90	99.95	99.99
		As	0.008	0.003	0.0005
		Fe	0.007	0.004	0.0025
		Cu	0.008	0.004	0.0005
		Pb	0.040	0.010	0.0035
	Impurity is not greater than	Bi	0.015	0.006	0.0025
		Sb	0.020	0.014	0.002
		Cd	0.0008	0.0005	0.0003
		Zn	0.001	0.0008	0.0005
		Al	0.001	0.0008	0.0005
		The sum	0.10	0.050	0.010

Table 2

	Chemical composition%
	Impure substance
	Sn	Pb	Sb	Cu	Bi	Zn	Fe	Al	As
H90S	89~91	The remnants of	<0.10	<0.03	<0.03	<0.005	<0.02	<0.005	<0.03
H63S	62~64	The remnants of	<0.10	<0.03	<0.03	<0.005	<0.02	<0.005	<0.03

	Chemical composition%
	Impure substance
	Sn	Pb	Sb	Cu	Bi	Zn	Fe	Al	As
H90A	89~91	The remnants of	<0.30	<0.05	<0.05	<0.005	<0.03	<0.005	<0.03
H63A	62~64	The remnants of	<0.30	<0.05	<0.05	<0.005	<0.03	<0.005	<0.03

metal impurities, as well as the anode rod if with organic impurities, will influence the quality of coating. As shown in table 3

impurity type	display harm content
( Fe2+ ) iron	0.03~0.05	coating brittle hair, produce pinhole
Cu ( Cu2+ )	0.01~0.05	low current density area of black, too much coating showed a cavernous
( Zn2+ ) zinc	0.02	coating crisp black stripes, low current density area black
organic impurities		coating brittle hair, black or shiny, to generate the fringe, pinhole

two, anode ball (rod) selection

anode ball ( rod ) of the selection and use of PCB quality to have the very big impact, according to process requirements to determine the general manufacturer. As of 99.9% Sn, 99.95% Sn, 90/10, 63/37, at the same time we must strictly control the products of various impurity content accords with the standard.

in Schedule 4 for reference

is not plated with tin tin

production fault	possible causes	correcting method
coating surface coarse large granular	bath in suspended particulate matter	filtering
coating dark hair is loose and porous	bath containing arsenic antimony and copper metals such as tin content in anode current density	electrolytic treatment, cathodic current density 0.2A/dm2 analysis adding stannous sulfate reduce the anode current density
	before plating polluted ( such as residual glue ) plating, surface overlap	strengthening treatment before plating, to ensure that the surface is clean and free from any pollution enhanced plating operation of normative, prevent surface overlap
production fault	possible causes	correcting method
coating dark crystallization bulky, plate edge roughness	bath additives such as wetting agent too little high current density	of Holzer cell test, fill appropriately additive decreased current density
coating is dark but uniform	plating solution with high content of	analysis and dilution plating solution, check and correction of
anode passivation	anode current density is too high	increase or decrease of anode current density
stripe coating	bath additive too little high current density	adding additives decreased current density
bath appear insoluble precipitate	anode mud purification, sulfuric acid content of less than	brushing anode, filtering and adding sulfate bath analysis
coating brittle or shedding of	organic pollution anode current density of high low temperature	activated carbon treatment reduce anode current density appropriately raise the temperature
plating air bubbles generated when	( 1) high current density	( 1) reduces the current density

In three,

in the operation process of attention:

1 ), electroplating process of anode preferably using acid anode bags, stop grooves do not remove the anode, to delay the two divalent tin oxide.

2 ), tin by mixing solution can obtain higher current density, but at the same time stirring will accelerate the two divalent tin oxide solution, causing hair mix, so the plating liquid generally use the continuous loop filter.

3 ), when the bath voltage drop, coating crystallization rough, bath throwing power decreases when, should be timely additive supplement.

4 ), bath temperature should be controlled at all additives permitted process range, and the anode current density is not too high, in order to avoid two of the price of tin oxide.

5 ), as a result of acidic bright tin plating cost is higher, the workpiece out of the groove should pay attention to the workpiece in the plating tank top to stay, after the workpiece surface residues of plating liquid drop the net after the move.

6 ), a workpiece plating tank cleaning, preferably after a weak base ( such as phosphate ) and processing, to improve the ability to prevent discoloration.

7 ), iron and steel parts after welding tin requirements before plating 3 μm copper layer, in order to strengthen the binding force; copper and copper alloy plating, to be charged into the groove, brass tin required pre plating of copper or nickel.

8 ), tin salt hydrolysate is loose colloidal shape, very difficult to filter, must join the flocculant, the condensation side can be filtered, such as polyacrylamide, SY-300 treatment agent and flocculant.

( 5) plating liquid impurities treatment

in sulfate tin plating solution, the buildup of impurities can cause the coating crystallization rough. Not bright, serious when black, brittle, coating binding force difference fault, so in electroplating production process, the effect of impurities must be caused enough recognition, impurities are introduced mainly in the following ways: workshop in the dust; pretreatment is not perfect, the cleaning is not thorough and into the residual acid or other filth; supplemented with miscellaneous quality more chemical raw materials; tin anode sludge with dissolved off down the other impure tin dissolved heavy metal ions; additive decomposition products continue to accumulate.

From the above it can be seen that , impurities into the plating solution way is many sided, these impurities accumulated to a certain extent inevitable seriously affects the quality of deposit. Of course, from the fundamental solution to the problem is to eliminate sources of impurities, but some impurities is inevitable, in order to effectively remove the impurities in plating solution, according to the types of impurities and characteristics of different processing methods. For physical impurities, including dust, anode slime slag and other fell into the plating groove solid insoluble, generally by filtration or plating solution stewing, absorbing liquid to another container, and then removing the bottom sludge can be; for the metal ion impurities including copper, arsenic, antimony and other, which mainly came from the impure tin anode sheets, chemical material and the conductive rod is dissolved, the impurity can cause the coating crystallization of dark, rough, serious when plating blackening, up stripe, even plating of qualified products, such impurities are usually adopts 0.1～ 0.3A/dm2 cathode current density electrolytic plating removed; liquid organic impurities from the additive decomposition products, these impurities when the amount is little on coating quality is not affected, but with the impurity accumulation accumulation to a certain extent, it will affect the tin layer quality, in addition to such impurities the most effective method is to use 1 ～3g/L activated carbon adsorption or special treating agent processing. Activated carbon adsorption organic impurities are very effective.