Flux series

lead-free flux

900B#

soldering flux for

lead-free flux

900#

hand dip furnace special flux

lead flux

800#

residue, face dirty

welding without preheating temperature is too low ( dip, time is too short );
approach too fast ( FLUX failed to fully volatilize );
solder temperature is not enough;
tin liquid with anti oxidant or oxidation resistant oil caused by too much flux coating;
;
component pin and plate hole ( Bucheng proportion hole too ) using flux rise; in the course of using
FLUX, a long time without adding diluent.

corrosion ( green, black)

preheating is not sufficient ( low preheat temperature, approach speed ) by FLUX residue, harmful residue too much; to use
cleaning flux, after welding without cleaning or not timely cleaning.

power, leakage ( insulation is not good )

PCB unreasonable design, wiring too close;
PCB solder film quality is not good, easy to conductive;
too reactive flux residues caused by strong, active ion.

The drain of the welding, welding, welding, even false welding

FLUX coated amount too low or uneven or low solid content; part
pads or the welding foot serious oxidation; (
PCB wiring unreasonable components distribution unreasonable);
foam pipe plug, foaming uneven, FLUX on the PCB coating uneven;
hand immersion tin improper methods of operation;
chain angle unreasonable or wave uneven;

Short circuit to

tin liquid caused by short circuit;

happened even welding but not detected
tin liquid does not meet the normal operating temperature, solder joint between "the tin wire " bypass;
solder joints slightly bead bypass;
happened even welding namely bridge;

2, PCB problems : such as the PCB itself solder film loss caused by short circuit.

of , taste great

FLUX itself problem;
resin: if an ordinary resin flue gas is larger;
solvent: here it refers to FLUX solvent odor or irritant gas may be large;
C activator: smoke, and pungent;
exhaust system not perfect.

splash, tin beads

technology

preheating temperature is lower ( FLUX solvent is not completely not volatile );
approach velocity meter fast does not reach the preheating effect;
chain angle is not good, the tin liquid between PCB and bubble, bubble burst after the
hand immersion tin tin; improper operation;
work in a damp environment or flux of high moisture content;

PCB board problem:

board of damp, the incomplete preheating, or water;
PCB run hole design not reasonable, resulting in PCB between
PCB and the tin liquid air pocket; unreasonable design, parts foot too dense caused air pocket.

tin is not good, not full tin

is using dual wave soldering process, a tin of effective components in FLUX has been completely volatile. The
approach speed is too slow, so that the preheating temperature is too high;
FLUX coating is not uniform;
pad, foot serious oxidation components, resulting in bad tin-absorbing;
FLUX coating is too little, failed to make PCB pads and components script completely;
PCB design unreasonable, causing components in PCB are not reasonable, influence some components of tin

PCB solder mask off, peeling or blistering

1, because the PCB manufacturing process problem;
A, washing is not clean;
B, inferior solder film;
C, PCB plate with solder mask matching;
T, drilling holes in the dirt into the solder film;
E, the usual hot tin too many times;
2 tin liquid temperature, preheating temperature is too high or;
3 welding, when too many times;
4, hand immersion tin operation, PCB tin liquid surface in the long residence time.